AWG-based photonic transmitter with DBR mirrors and Mach-Zehnder modulators

In this letter, we demonstrate a novel monolithically integrated photonic multiwavelength transmitter that was realized by integrating an arrayed waveguide grating-based laser with selective distributed Bragg reflector mirrors and Mach-Zehnder modulators. The integrated circuit was designed according to a generic integration model, by utilizing standardized photonic building blocks, and was fabricated on an InP-based platform in a multiproject wafer run. The device delivers above 1 mW of optical power into the fiber with a side mode suppression ratio better than 40 dB. The linewidth of the generated signals is 275 kHz. We achieved error free 50-km transmission at the modulation data rate of 10 Gb/s per channel, for a received power of -26.5 dBm

Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges

An introduction to InP-based generic integration technology

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets. Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology

An introduction to InP-based generic integration technology

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets.Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology.Funding is acknowledged by the EU-projects ePIXnet, EuroPIC and PARADIGM and the Dutch projects NRC Photonics, MEMPHIS, IOP Photonic Devices and STW GTIP. Many others have contributed and the authors would like to thank other PARADIGM and EuroPIC partners for their help in discussions, particularly Michael Robertson (CIP).This is the final published version distributed under a Creative Commons Attribution License. It can also be viewed on the publisher's website at: http://iopscience.iop.org/0268-1242/29/8/08300

Photonic ICs in a generic foundry

A generic foundry model in photonics enables design and fabrication of a variety of different photonic devices, for many applications, using standardized high-performance foundry platforms. Access to the generic foundries is available via multi-project wafer runs. In this way, the costs for developing photonic ICs are reduced by more than an order of magnitude and come within reach for SMEs and universities. The reduction of processing costs is achieved by costs-sharing among many application users participating in one fab cycle, and by reusing standardized and parameterized photonic components. A closer view on an indium phosphide based photonic ICs is given

Photonic ICs in a generic foundry

A generic foundry model in photonics enables design and fabrication of a variety of different photonic devices, for many applications, using standardized high-performance foundry platforms. Access to the generic foundries is available via multi-project wafer runs. In this way, the costs for developing photonic ICs are reduced by more than an order of magnitude and come within reach for SMEs and universities. The reduction of processing costs is achieved by costs-sharing among many application users participating in one fab cycle, and by reusing standardized and parameterized photonic components. A closer view on an indium phosphide based photonic ICs is given